I-6A2T ikhokelele ibhondi yensimbi yensimbi yokuGcina ivili

I-6A2T ikhokelele ibhondi yensimbi yensimbi yokuGcina i-Gouil ye-Wheemond ye-Guilling Grensing Preving

Inkcazo emfutshane:

Ivili ledayimani elingasemva lisetyenziswa ngokubanzi kumzi-mveliso we-elektroniki olunjengamachiza akhokelwe yi-silicon yesekethe, eyokucofa i-himicion ye-semicondcuction kunye ne-semiconductor ye-semiciamond i-vieles.

Thumela i-imeyile kuthi

Iinkcukacha zemveliso

Iimpawu zeMveliso

I-1.metal ye-Gayimane yeDiamoning isetyenziselwa ukucocwa kwe-saphire ye-safhire ye-saffire wafs, i-silicon chips, i-gesium ye-gesium, kunye ne-chip ye-Gan kwishishini le-LED. Ivili le-grinding elingasemva lokukhutshwa kwe-LED lithunyelwe kumazwe amaninzi, ngentsebenzo ebalaseleyo yokugqwesa kunye nokuxabisa iindleko eziphezulu.
I-2. Umsebenzi wokuSebenza: I-Saphire Epitaxial Wafer, i-SIC ye-SIC ye-Fic Fritatial Wafer, i-Sitative ye-titaxial ye-SICT.
I-3.MalfAtece yomsebenzi oSebenzayo: ISapfitic Syfitic, i-SIC, i-Sericon enye.
4.Grinds: Shuwa, i-Shuwa, i-Wec, Galaxy, isantya seSantya, Ekamoto.

Igama lemveliso	Ivili le-griind eligagaleyo lokukhutshwa kwe-LED
Iqhina	Intsimbi
Imilo	I-6a2t
Ubungakanani	I-209mm, 254Mm, 313mm, ngokwezifiso
Izixhobo	I-Synthitic Saphire, i-SIC, i-systal slicon eyodwa

I-1.High Jiction ye-Wordpiece yomhlaba kunye nomgangatho womhlaba olungileyo
2.Ukugcinwa kwendawo yokugcina umsebenzi
I-3.High yokuGcina yokuSebenza
4.Ukuba amandla okugaya kunye nobushushu obuphantsi bokugaya